On June 10, industry sources reported that Samsung Electronics is planning to build a new advanced semiconductor packaging facility in Gwangju, South Korea, to meet surging global AI chip demand. The investment is expected to be officially announced during a presidential meeting with conglomerate leaders on June 29. Samsung has not yet commented.

As advanced packaging becomes critical for AI chip performance – especially for High Bandwidth Memory (HBM) – the new plant would strengthen Samsung’s packaging capacity. Samsung already supplies major AI players including Nvidia, AMD, and Google. In May, Samsung began shipping samples of its 12‑layer HBM4E , accelerating its push to challenge market leader SK Hynix.

ICgoodFind: A new Samsung packaging fab in Gwangju would expand its HBM and AI chip supply chain footprint, intensifying competition in advanced memory.